The student team from Wisconsin Indianhead Technical College took home top prize in the second annual PACK EXPO Student Design Competition. The contest challenged packaging students to use Packexpo.com and PACK EXPO International to find a conveying-related packaging line solution.
The winning team — Tony Aubart, Chelsea Lambert, Steve Volkert, Jim Briese and Matt Woehrman of Wisconsin Indianhead Technical College– will share a scholarship of $4,000.
The second-place team, from Purdue University Calumet, receives a $2,000 scholarship and University of Florida’s third place team shares a $1,000 scholarship.
Students from 9 schools competed, and in the eyes of PMMI Vice President of Education and Workforce Development Maria Ferrante, the true ‘grand prize’ was the experience each student gained.
“The PACK EXPO Student Design Competition takes learning beyond the classroom by giving students the opportunity to solve real world problems in a business environment,” says Ferrante.
The teams researched their projects at Packexpo.com and on site in Chicago, and presented them to a panel of judges from the packaging industry:
- Art Sagy, Kraft
- Paul Redwood, Church & Dwight
- Doug Farrell, Redco Foods Inc.
- Loc To, Unilever
“I’d like to congratulate the Wisconsin Indianhead Technical College team and thank our judges as well as all of our participants. Each team brought excellent solutions to the table,” Ferrante adds. “PMMI and PMMI U are always excited to engage the packaging leaders of the future here at PACK EXPO.”
The PMMI Education & Training Foundation provided the scholarship funds.
To learn more about PMMI U and PMMI’s Workforce Development efforts, contact Maria Ferrante: email@example.com or 703.243.8555.